JPH0715141Y2 - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPH0715141Y2 JPH0715141Y2 JP15971486U JP15971486U JPH0715141Y2 JP H0715141 Y2 JPH0715141 Y2 JP H0715141Y2 JP 15971486 U JP15971486 U JP 15971486U JP 15971486 U JP15971486 U JP 15971486U JP H0715141 Y2 JPH0715141 Y2 JP H0715141Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- connector portion
- circuit board
- hybrid integrated
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 46
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 12
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15971486U JPH0715141Y2 (ja) | 1986-10-17 | 1986-10-17 | 混成集積回路 |
| DE8787114938T DE3777324D1 (de) | 1986-10-15 | 1987-10-13 | Integrierte hybridschaltungsanordnung, die in einen sockel eingesteckt werden kann. |
| EP87114938A EP0264780B1 (en) | 1986-10-15 | 1987-10-13 | Hybrid integrated circuit device capable of being inserted into socket |
| US07/107,990 US4884125A (en) | 1986-10-15 | 1987-10-13 | Hybrid integrated circuit device capable of being inserted into socket |
| KR1019870011409A KR900007232B1 (ko) | 1986-10-15 | 1987-10-14 | 혼성집적회로 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15971486U JPH0715141Y2 (ja) | 1986-10-17 | 1986-10-17 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6365245U JPS6365245U (en]) | 1988-04-30 |
| JPH0715141Y2 true JPH0715141Y2 (ja) | 1995-04-10 |
Family
ID=31084401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15971486U Expired - Lifetime JPH0715141Y2 (ja) | 1986-10-15 | 1986-10-17 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0715141Y2 (en]) |
-
1986
- 1986-10-17 JP JP15971486U patent/JPH0715141Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6365245U (en]) | 1988-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0570316B2 (en]) | ||
| KR900007232B1 (ko) | 혼성집적회로 | |
| JPH0715141Y2 (ja) | 混成集積回路 | |
| JPH0445253Y2 (en]) | ||
| JPH0639483Y2 (ja) | 混成集積回路 | |
| KR100397161B1 (ko) | 전자장치의방열구조 | |
| JP2504486B2 (ja) | 混成集積回路構造 | |
| JPH0469821B2 (en]) | ||
| JPH0531839B2 (en]) | ||
| JPH0469820B2 (en]) | ||
| JPH0534131Y2 (en]) | ||
| JPH06268086A (ja) | 半導体集積回路装置およびそれが装着されるプリント基板 | |
| JPH0442937Y2 (en]) | ||
| JPH11251186A (ja) | スタック型セラミックコンデンサ | |
| JPH0442938Y2 (en]) | ||
| JPH0519974Y2 (en]) | ||
| JPH0617317Y2 (ja) | 混成集積回路の接続構造 | |
| JP2771575B2 (ja) | 混成集積回路 | |
| JPH0423322Y2 (en]) | ||
| CN119545638A (zh) | 功率模块和用于制造功率模块的方法 | |
| JPH064605Y2 (ja) | 混成集積回路 | |
| JPH056715Y2 (en]) | ||
| JP2526482Y2 (ja) | 混成集積回路 | |
| WO2024070581A1 (ja) | 電力変換ユニット | |
| JPH06824Y2 (ja) | 混成集積回路 |